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テクノメイトロゴマーク 株式会社テクノメイト Technomate CO.,LTD

Slurry supplying apparatus

Continuous slurry dispenser (P85)

Continuous slurry dispenser Temperature and fluid control / Slurry supplying apparatus

    Product Summary
    We have diluted the stock solution and supplied the temperature controlled slurry to the polishing machine continuously and realized space saving, energy saving and low cost by our proprietary transfer, dilution and temperature control system.
    Use
    Back grinder, CMP, polish grinder, grinding equipment

specification

  • slurry

    Colloidal silica-based pH11

  • Dilution factor

    10, 15, 20 times

  • pH control

    pH10~11±0.2

  • Temperature control

    20~40±0.5℃

  • The supply flow rate

    1.5L/min 、0.3MPa

  • Slurry tank

    20L built-in

  • Ammonia tank

    5L built

  • External dimensions

    W1250*D580*H1400

  • weight

    500kg

Simple slurry dispenser

Simple slurry dispenser
Temperature and fluid control / Slurry supplying apparatus

    Product Summary
    An experimental feeder for supplying diluted and mixed slurry solution in a tank to a device
    Use
    Wafer polishing

specification

  • Model

    P65

  • tank capacity

    125L Ivory PVC

  • Diaphragm pump

    10L/min

  • Supply air

    85L/min

  • Power capacity

    AC100V 5A

Slurry supplying apparatus for CMP

Slurry supplying apparatus for CMP P108
Temperature and fluid control / Slurry supplying apparatus

    Product Summary
    This apparatus dilutes the slurry stock solution and supplies slurry to the polishing machine.
    Use
    Semiconductor wafer CMP process.

specification

  • Model

    P108

  • Diluent flow rate

    3~4L/min at 0.2MPa

  • Supply pressure

    0.2MPa max

  • Supply tank capacity

    27L

  • Pump for transferring the original liquid

    Teflon diaphragm pump

  • Pump for delivering diluted liquied

    Bellows pump and damper